[yocto-ab] YP Advisory Board: VOTE YP Compatible, Timesys LinuxLink 5.0

akuster akuster at mvista.com
Wed Feb 10 12:50:09 PST 2016


Yes from MontaVista

- armin

On 02/10/2016 11:56 AM, Jeff Osier-Mixon wrote:
> Hi all - Timesys is about to release their latest YP-based product.
> Note that the "no" answers are actually "n/a" due to the nature of
> their product.
> 
> Please vote yes/no on YP Compatible status for LinuxLink 5.0
> 
> thanks
> 
>    --Contact information--
>      Organization: Timesys Corporation
>      Project name: LinuxLink 5.0
>      Contact name: Theresa Kisha
>      Contact email address: theresa.kisha at timesys.com
>      URL to organization or product link: http://ll5.timesys.com/
>      Registration date: 2016-02-10
>      Compliance Agreement revision: 1.0
>      Yocto Project Compatible Version: 2.0
> 
> 
> Acceptance Criteria:
>   - Working towards and supporting the aims and objectives of the Yocto
> Project. These include decreasing the fragmentation of embedded ecosystem and
> focus around a common shared set of tools, formats and best practices. We
> want to avoid multiple groups of people repeating the same work and have one
> set of great tools rather than multiple tools with drawbacks.: Yes
>   - Promoting the OpenEmbedded architecture, layer model, and BSP format.:Yes
>   - Making visible contributions in the OpenEmbedded and component projectsof
> the Yocto Project. Please describe your participation in the comments section
> below.: Yes
>   - Are all your publicly accessible layers listed in the OpenEmbedded Layers
> index (http://layers.openembedded.org)?: Yes
>   - Be a non-profit, or member of the Yocto Project working group, regardless
> of organization size, or if the project's parent organization is an
> open-source project.: Yes
>   - If the project includes build system functionality, are BitBake and
> OpenEmbedded-Core included as components?: Yes
>   - If present, can the directories containing BitBake and OpenEmbedded-Core
> be clearly identified within the system and only contain those components?:
> Yes
>   - Have all patches applied to BitBake and OpenEmbedded-Core (if present)
> been submitted to the open source community?: Yes
>   - Do all layers contain a README file which details the origin of thelayer,
> its maintainer, where to submit changes, and any dependencies or version
> requirements?: Yes
>   - Do all layers build without errors against OpenEmbedded-Core with onlythe
> dependencies/requirements listed in their README file?: No (explain below)
>   - (For BSPs) Does the layer follow the format defined in the Yocto Project
> Board Support Package (BSP) Developers Guide?: No (explain below)
>   - Are hardware support, configuration (distro) policy, and recipe metadata
> separated into different layers which do not depend on each other?: No
> (explain below)
>   - Is a test report document included showing which combinations of layers,
> recipes, and machines have been tested?: No (explain below)
>   - If any item in the "Yocto Project Compatible Compliance Recommendations"
> list is not true, is this documented in the testing report?: Yes
> Recommendations:
>   - Linux kernels are either based around LTSI kernel versions or a Yocto
> Project kernel version.: Yes
>   - Everything builds successfully with the standard toolchain from OE-Core,
> where the architecture is one supported by OE-Core as standard. This is to
> ensure that your layers are compatible with OE-Core. It is not required that
> the OE-Core toolchain be provided to customers or any downstream projects.:
> Yes
> Explanation:
> The LinuxLink 5.0 Yocto Project wizard is a getting started tool for Yocto
> customization. This tool helps users create a custom image for a given Yocto
> Project release and machine.
> 
> LinuxLink 5.0 is compatible with Yocto Project versions 1.7, 1.8 and 2.0
> 
> NOTE: There are four (4) questions above for which I have answered "No."  For
> these four questions, I was unable to choose "NA" ... as the questions are
> not applicable. Our LinuxLink tool provides a mechanism for puling in the
> layers.
> 



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